Two-Dimensional Electromagnetic Field Solvers, 124.Combined Traveling Wave and Diffusive Response, 102 ģ.4.3 Common- and Differential-Mode Impedanceģ.5 Wire Cost Models 3.5.1 Wire Area Costs 3.5.2 Terminal Costs 3.6 Measurement Techniquesģ.6.1 Time-Domain Measurements The Time-Domain Reflectometer, 117 ģ.6.3 CAD Tools for Characterizing Wires Spreadsheets, 124.Source Termination and Multiple Reflections, 97 ģ.3.4 Lossy LRC Transmission Lines Wave Attenuation, 100.Reflections and the Telegrapher's Equation, 95.Low-Frequency RC Lines, 92 3.3.3 Lossless LC Transmission Lines Traveling Waves, 92.Lumped Models of Impedance Discontinuities, 90.Lumped Models of Transmission Lines, 88.Code-Division MUltiple Access (CDMA), 75ģ.1 Geometry and Electrical Properties 3.1.1 Resistanceģ.2 Electrical Models of Wires 3.2.1 The Ideal Wire 3.2.2 The Transmission Line.
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INTRODUCTION TO DIGITAL SYSTEMS ENGINEERINGġ.1 Why Study Digital Systems Engineering?ġ.2 An Engineering View of a Digital Systemġ.2.2 Signaling Conventions Signaling Speed, 7 ġ.2.3 Timing and Synchronization Synchronous Timing, 8 ġ.3 Technology Trends and Digital Systems Engineeringġ.3.3 Scaling of Wires Scaling of Power Distribution, 18 ġ.3.4 High Levels of Integration Permit New Approachesġ.3.5 Digital Systems Problems and Solutions Continue to ChangeĢ.1 A Typical Digital System 2.2 Digital Integrated Circuits - On-Chip Wiring 2.3 Integrated Circuit Packages 2.3.1 Wire Bonds and Solder Balls 2.3.2 Package Types 2.3.3 Package Manufacturing Processes 2.3.4 Multichip Modules 2.3.5 A Typical Package ModelĢ.4 Printed Circuit Boards 2.4.1 PC Board Construction 2.4.2 Electrical Properties 2.4.3 Manufacturing Process 2.4.4 Vias 2.4.5 Dimensional Constraints 2.4.6 Mounting Components: Surface-Mount and Through-HoleĢ.4.7 Sockets 2.5 Chassis and Cabinets 2.6 Backplanes and Mother Boards 2.6.1 Daughter Cards 2.6.2 Backplanes 2.7 Wire and Cable 2.7.1 Wires 2.7.2 Signaling CablesĢ.7.3 Bus Bars 2.S Connectors 2.S.1 PC Board Connectors 2.S.2 Interposers 2.S.3 Elastomeric Connectors 2.S.4 Power Connectors 2.S.5 Wire and Cable Connectors Wire Harness Connectors, 58 Ģ.9 Optical Communication 2.9.1 Optical TransmittersĢ.9.3 Optical Receivers 2.9.4 Multiplexing In the background is a plot of the layout of a PixelFlow EMC chip, the heart of a high-performance graphics system developed by Poulton and his colleagues at UNC. Behind this trace is a 512-processor J-Machine, an experimental parallel computer developed by Dally and his group at MIT. In the foreground is an oscilloscope trace showing an eye diagram of an equalized 4Gb/s signaling system jointly developed by the authors. TK7888.3.D2934 621.39 - dc21Ībout the cover: The photo on the cover shows three of the authors' projects. Electronic digital computers - Design and construction.
Includes bibliographical references ISBN 2-5 (hb) I.
Library of Congress Cataloging-in-Publication Data Dally, William J. and Copperplate Gothic in IbTIjX A catalog recordfor this book is available from the British Library First published 1998 Printed in the United States of America Typeset in Times Roman 10.5/13 pt. Subject to statutory exception and to the provisions of relevant collective licensing agreements, no reproduction of any part may take place without the written permission of Cambridge University Press. The Edinburgh Building, Cambridge CB2 2RU, UK 40 West 20th Street, New York, NY 10011-4211, USA 10 Stamford Road, Oakleigh, Melbourne 3166, Australia The Pitt Building, Trumpington Street, Cambridge CB2 IRP, United Kingdom CAMBRIDGE UNIVERSITY PRESS PUBLISHED BY THE PRESS SYNDICATE OF THE UNIVERSITY OF CAMBRIDGE
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